Cyntec’s technology platform of Electronic Materials Packaging for High Power Circuits, Heat Sink Design Simulation and High Current Metal Lead Frame, allowed us to produce a wide variety of Power Modules.
Material:
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Embedded substrate lamination material
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Copper lead frame surface treatment
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Ceramic substrate for direct copper bonding
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Encapsulation molding compound
Design & Simulation:
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Power topology design and optimization
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Multi-physics coupling co-simulation
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Molding cavity design and mold ¬flow simulation
Process
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Embedded active/passive 3D packaging
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Thin lm photolithography and electroplating
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Encapsulation process (molding, casing, dispensing)
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High density laser drilled via connections
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Au/Al wire bonding interconnection
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High precision die attaching
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High temp soldering SMT and vacuum re¬flow
Analysis
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Packaging structure (X-ray, De-capsulation)
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Material property (SEM, EDX)
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Semiconductor reliability (EMMI, OBIRCH)
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Adhesion and thermal expansion property analysis
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Thermal conductivity and electrical isolation