Cyntec’s technology platform of Electronic Materials Packaging for High Power Circuits, Heat Sink Design Simulation and High Current Metal Lead Frame, allowed us to produce a wide variety of Power Modules.
Material:

Embedded substrate lamination material

Copper lead frame surface treatment

Ceramic substrate for direct copper bonding

Encapsulation molding compound
Design & Simulation:

Power topology design and optimization

Multi-physics coupling co-simulation

Molding cavity design and mold ¬flow simulation
Process

Embedded active/passive 3D packaging

Thin lm photolithography and electroplating

Encapsulation process (molding, casing, dispensing)

High density laser drilled via connections

Au/Al wire bonding interconnection

High precision die attaching

High temp soldering SMT and vacuum re¬flow
Analysis

Packaging structure (X-ray, De-capsulation)

Material property (SEM, EDX)

Semiconductor reliability (EMMI, OBIRCH)

Adhesion and thermal expansion property analysis

Thermal conductivity and electrical isolation