Cyntec, a leading provider of power magnetics and resistive current sensing solutions, will showcase its latest innovations for automotive electrification and AI computing at Electronica, taking place in Munich from 10-13 November, 2026.
As vehicle electrification and AI computing continue to drive unprecedented demands for higher power density, efficiency, thermal performance, and functional safety, Cyntec will demonstrate how its advanced magnetic components, power modules, and current sensing technologies help address these challenges across next-generation automotive and AI computing platforms.
Visitors to the Cyntec booth will discover two featured application zones:
Advanced Power Solutions for Smart and Green Mobility
The Automotive zone highlights four key applications shaping the future of vehicle electrification and intelligent mobility:
-Advanced Driver Assistance Systems (ADAS)
The increasing demand for higher computing performance and faster data communication is driving new requirements for ADAS. Cyntec offers miniaturized, low-loss inductors that deliver stable power to SoCs and PMICs, while its Power-over-Coax (PoC) inductors enable both power delivery and high-speed data transmission over a single cable for cameras and radar systems. High-speed common-mode filters further ensure reliable Automotive Ethernet and CAN communications.
-Battery Disconnect Unit (BDU)
Accurate sensing and fast protection are critical for automotive BDUs. Cyntec's calibration-free shunt sensors minimize calibration requirements while maintaining reliable performance across a wide range of operating conditions. Its ASIL-C/D compliant shunt modules support ISO 26262 functional safety standards and provide industry-leading current measurement accuracy of up to ±0.1%.
-EV Powertrain
As EV powertrains evolve, demand is growing for more compact and efficient power conversion solutions. Cyntec's transformer technologies for OBCs reduce transformer size or height by up to 30%, while low-profile transformers for HV DC-DC converters cut height by up to 40% with lower high-frequency losses. For traction inverters, insulated over-molded EMI filters reduce size by up to 35% and weight by up to 30%.
-SiC Power Module
Cyntec's Silicon Carbide (SiC) power module portfolio delivers high-efficiency solutions for a range of e-mobility applications. For traction inverters, the integrated 3-in-1 module features uniform cooling and an ultra-compact, leadframe-less design, reducing package size by 60% and stray inductance by 50% to enhance power density and switching performance. For on-board charger (OBC) applications, a thermally decoupled architecture eliminates extra insulation layers to reduce thermal resistance and parasitic capacitance, enabling higher efficiency, greater power density, and faster charging for next-generation EVs.
High-Performance AI Computing Solutions
Cyntec will showcase advanced power solutions designed to support next-generation AI servers, networking equipment, and emerging 800Vdc data center power architectures.
-High Power Density Module for AI Chipset
For AI platforms exceeding 5 kW of board-level power consumption, efficient power module becomes increasingly critical. Cyntec's power module technology enables space-saving, high-density power distribution while improving conversion efficiency.
-High Power Magnetics for Grid to White Space
Cyntec provides High Power Magnetics, including Common Mode Chokes, Molded Type Chokes, and DC-DC Transformers, designed to deliver ultra-high-power density and exceptional efficiency in a compact footprint. Featuring optimized heat dissipation paths and reduced magnetic leakage flux, these components seamlessly integrate into PSUs, BBUs, and CBUs.
-SiC Power Modules for AI Data Center
Cyntec's Silicon Carbide (SiC) power modules optimize end-to-end efficiency across next-generation AI data center infrastructures. The portfolio features advanced power modules maximizing AC-to-DC conversion across power shelves and racks alongside downstream DC-DC networks, complemented by specialized modules for solid-state transformers and circuit breakers providing robust protection and stable power delivery.
Cyntec welcomes automotive engineers, system designers, researchers, and industry media to visit Hall A6, Booth 303 and experience these innovations first-hand. Engage with our technical experts to discuss emerging industrial trends and learn how Cyntec’s advanced component technologies are enabling the next generation of ECU, xEV, and AI computing platforms.
For more detailed information, please visit www.cyntec.com.
About Cyntec
Since 1991, Cyntec has led the way in the research and development of power electronics components, miniaturized and highly integrated products and solutions. The product lines include magnetic components, passive components, and power modules, which serve the client, cloud computing equipment, automotive, industry, and other market segments.
Media Contact:
Christian Gellmann
Automotive Segment Business Manager, Cyntec EMEA
E-mail: Christian.Gellmann@cyntec.com