Cyntec has been developing miniaturized components with high level of integration for many years. Using our advanced design and processing technologies, we have established four technology platforms for passive components, sensors, high frequency RF components, and power modules.

At Cyntec we do widely use combinations of substrate materials (ceramic, glass, silicon material, etc…) and processing technologies (photolithography, thick film technologies) to produce passive components such as chip resistors, resistor arrays and current sensors which provide the best design and performance solutions for the computer and communication products.

Cyntec has established a analytical database for design and simulation of high frequency circuits to achieve the state-of-the-art RF component integration. Our Band Pass Filters and Diplexers are designed to meet the requirements of the smallest and lowest profile (Thinnest) devices in the wireless broadband market.

With expertise in the miniaturization technology including micro-powder molding and coil forming, we have developed and produced a complete series of high saturation current and low DCR surface mount molding type power chokes.

Cyntec’s technology platform for power modules consists of electronic packaging, circuits with high power handling, thermal management, and high current metallic leads. The platform enables Cyntec
to provide services for development and production of miniaturizes power module for inverter type motor controls, IPM (Intelligent Power Module), and high speed switching power for digital control units, POL (Point of Load convertor).