Technology Leadership

Advanced Packaging Technology

Material

• Embedded substrate lamination material

• Copper lead frame surface treatment

• Ceramic substrate for direct copper bonding

• Encapsulation molding compound

Design & Simulation

• Power topology design and optimization

• Multi-physics coupling co-simulation

• Molding cavity design and mold ¬flow simulation

Process

• Embedded active/passive 3D packaging

• Thin lm photolithography and electroplating

• Encapsulation process (molding, casing, dispensing)

• High density laser drilled via connections

• Au/Al wire bonding interconnection

• High precision die attaching

• High temp soldering SMT and vacuum re¬flow

Analysis

• Packaging structure (X-ray, De-capsulation)

• Material property (SEM, EDX)

• Semiconductor reliability (EMMI, OBIRCH)

• Adhesion and thermal expansion property analysis

• Thermal conductivity and electrical isolation